The revolutionary activator system in AIM's new NC273LT low temperature solder paste improves the wetting performance of bismuth alloys to RoHS compliant plating and surface finishes, while ensuring long stencil life, excellent transfer efficiencies and minimizes solder balling common to high bismuth materials.  The majority of lead-free solutions require higher processing temperatures than their lead bearing predecessors.  In some cases, these higher temperatures cannot be tolerated by other materials in the assembly.